Erqiang Liu

Orcid: 0000-0002-8034-5396

According to our database1, Erqiang Liu authored at least 2 papers between 2014 and 2024.

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Bibliography

2024
Enhancing the reliability of CSP solder joints under thermal cycling conditions through particle swarm optimization of an improved BP neural network.
Microelectron. J., 2024

2014
Tenacity of total graphs.
Int. J. Found. Comput. Sci., 2014


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