Franz Schrank

According to our database1, Franz Schrank authored at least 10 papers between 2010 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

On csauthors.net:

Bibliography

2018
Thermal transient measurement and modelling of a power cycled flip-chip LED module.
Microelectron. Reliab., 2018

Parameter driven monitoring for a flip-chip LED module under power cycling condition.
Microelectron. Reliab., 2018

Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations.
Microelectron. Reliab., 2018

2017
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation.
Microelectron. Reliab., 2017

Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
Microelectron. Reliab., 2017

2016
Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy.
Microelectron. Reliab., 2016

2014
Manufacturing of 3D integrated sensors and circuits.
Proceedings of the 44th European Solid State Device Research Conference, 2014

Bimetallic nanoparticles for optimizing CMOS integrated SnO2 gas sensor devices.
Proceedings of the 44th European Solid State Device Research Conference, 2014

2013
Optimized integrated micro-hotplates in CMOS technology.
Proceedings of the IEEE 11th International New Circuits and Systems Conference, 2013

2010
Through Silicon Via (TSV) defect investigations using lateral emission microscopy.
Microelectron. Reliab., 2010


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