Hendrik J. Vos
Orcid: 0000-0002-8580-4766
According to our database1,
Hendrik J. Vos
authored at least 21 papers
between 2009 and 2025.
Collaborative distances:
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Bibliography
2025
Correction to "A 2000-Volumes/s 3-D Ultrasound Probe With Monolithically-Integrated 23 × 23-mm<sup>2</sup> 4096-Element CMUT Array".
IEEE J. Solid State Circuits, August, 2025
A 2000-volumes/s 3-D Ultrasound Probe With Monolithically-Integrated 23 × 23-mm² 4096 -Element CMUT Array.
IEEE J. Solid State Circuits, April, 2025
2024
A 125 μ m-Pitch-Matched Transceiver ASIC With Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography.
IEEE J. Solid State Circuits, August, 2024
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes.
IEEE J. Solid State Circuits, February, 2024
A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm<sup>2</sup> 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
2023
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging.
IEEE J. Solid State Circuits, September, 2023
A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
IEEE J. Solid State Circuits, 2023
A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Sensors, 2022
A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography.
IEEE J. Solid State Circuits, 2022
A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging.
Sensors, 2021
Combining Ultrafast Ultrasound and High-Density EMG to Assess Local Electromechanical Muscle Dynamics: A Feasibility Study.
IEEE Access, 2021
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
Proceedings of the 47th ESSCIRC 2021, 2021
2018
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging.
IEEE J. Solid State Circuits, 2018
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
IEEE J. Solid State Circuits, 2018
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2017
A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017
2016
A front-end ASIC with receive sub-array beamforming integrated with a 32 × 32 PZT matrix transducer for 3-D transesophageal echocardiography.
Proceedings of the 2016 IEEE Symposium on VLSI Circuits, 2016
2009
Medical Biol. Eng. Comput., 2009