Michiel A. P. Pertijs
Orcid: 0000-0002-9891-4374Affiliations:
- Delft University of Technology, The Netherlands
According to our database1,
Michiel A. P. Pertijs
authored at least 68 papers
between 2001 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes.
IEEE J. Solid State Circuits, February, 2024
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
2023
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging.
IEEE J. Solid State Circuits, September, 2023
A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
IEEE J. Solid State Circuits, 2023
A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Sensors, 2022
Algorithm to Correct Measurement Offsets Introduced by Inactive Elements of Transducer Arrays in Ultrasonic Flow Metering.
Sensors, 2022
Measurement of Pipe and Liquid Parameters Using the Beam Steering Capabilities of Array-Based Clamp-On Ultrasonic Flow Meters.
Sensors, 2022
A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography.
IEEE J. Solid State Circuits, 2022
A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
IEEE Trans. Instrum. Meas., 2021
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging.
Sensors, 2021
IEEE J. Solid State Circuits, 2021
A Readout IC for Capacitive Touch Screen Panels With 33.9 dB Charge-Overflow Reduction Using Amplitude-Modulated Multi-Frequency Excitation.
IEEE J. Solid State Circuits, 2021
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021
2020
A 64-Channel Transmit Beamformer With ±30-V Bipolar High-Voltage Pulsers for Catheter-Based Ultrasound Probes.
IEEE J. Solid State Circuits, 2020
IEEE J. Solid State Circuits, 2020
23.6 A 2pA/√Hz Transimpedance Amplifier for Miniature Ultrasound Probes with 36dB Continuous-Time Gain Compensation.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
28.1 A Capacitive Touch Chipset with 33.9dB Charge-Overflow Reduction Using Amplitude-Modulated Multi-Frequency Excitation and Wireless Power and Data Transfer to an Active Stylus.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2019
A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
An Integrated Programmable High-Voltage Bipolar Pulser With Embedded Transmit/Receive Switch for Miniature Ultrasound Probes.
Proceedings of the 45th IEEE European Solid State Circuits Conference, 2019
2018
A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging.
IEEE J. Solid State Circuits, 2018
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging.
IEEE J. Solid State Circuits, 2018
IEEE J. Solid State Circuits, 2018
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
IEEE J. Solid State Circuits, 2018
IEEE J. Solid State Circuits, 2018
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
A phase-domain readout circuit for a CMOS-compatible thermal-conductivity-based carbon dioxide sensor.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2017
A Precision Capacitance-to-Digital Converter With 16.7-bit ENOB and 7.5-ppm/°C Thermal Drift.
IEEE J. Solid State Circuits, 2017
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography.
IEEE J. Solid State Circuits, 2017
J. Sensors, 2017
Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017
A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017
A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound.
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017
2016
IEEE J. Solid State Circuits, 2016
A Ratiometric Readout Circuit for Thermal-Conductivity-Based Resistive CO<sub>2</sub> Sensors.
IEEE J. Solid State Circuits, 2016
Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016
2015
Proceedings of the 6th International Workshop on Advances in Sensors and Interfaces, 2015
Proceedings of the 6th International Workshop on Advances in Sensors and Interfaces, 2015
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015
27.7 A 0.05mm<sup>2</sup> 1V capacitance-to-digital converter based on period modulation.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015
Session 27 overview: Physical sensors: Imagers, MEMS, medical and displays subcommittee.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015
Proceedings of the ESSCIRC Conference 2015, 2015
Proceedings of the ESSCIRC Conference 2015, 2015
2014
IEEE J. Solid State Circuits, 2014
An eddy-current displacement-to-digital converter based on a ratio-metric delta-sigma ADC.
Proceedings of the ESSCIRC 2014, 2014
2013
IEEE J. Solid State Circuits, 2013
An Interface for Eddy-Current Displacement Sensors With 15-bit Resolution and 20 MHz Excitation.
IEEE J. Solid State Circuits, 2013
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013
2012
IEEE J. Solid State Circuits, 2012
Proceedings of the Symposium on VLSI Circuits, 2012
Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012
2011
A Single-Temperature Trimming Technique for MOS-Input Operational Amplifiers Achieving 0.33 μ V/°C Offset Drift.
IEEE J. Solid State Circuits, 2011
Proceedings of the 37th European Solid-State Circuits Conference, 2011
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2011
2010
A 140 dB-CMRR Current-Feedback Instrumentation Amplifier Employing Ping-Pong Auto-Zeroing and Chopping.
IEEE J. Solid State Circuits, 2010
A Thermal-Diffusivity-Based Frequency Reference in Standard CMOS With an Absolute Inaccuracy of ±0.1% From - 55°C to 125°C.
IEEE J. Solid State Circuits, 2010
2009
A 140dB-CMRR current-feedback instrumentation amplifier employing ping-pong auto-zeroing and chopping.
Proceedings of the IEEE International Solid-State Circuits Conference, 2009
A CMOS smart temperature sensor with a batch-calibrated inaccuracy of ±0.25°C (3σ) from -70°C to 130°C.
Proceedings of the IEEE International Solid-State Circuits Conference, 2009
2008
A BiCMOS Operational Amplifier Achieving 0.33μV°C Offset Drift using Room-Temperature Trimming.
Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008
Sigma delta ADC with a dynamic reference for accurate temperature and voltage sensing.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2008), 2008
2007
Proceedings of the 33rd European Solid-State Circuits Conference, 2007
2005
IEEE J. Solid State Circuits, 2005
IEEE J. Solid State Circuits, 2005
2004
Proceedings of the 33rd European Solid-State Circuits Conference, 2004
2001
A high-accuracy temperature sensor with second-order curvature correction and digital bus interface.
Proceedings of the 2001 International Symposium on Circuits and Systems, 2001