Hendrik J. Vos

Orcid: 0000-0002-8580-4766

According to our database1, Hendrik J. Vos authored at least 17 papers between 2009 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2024
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes.
IEEE J. Solid State Circuits, February, 2024

2023
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging.
IEEE J. Solid State Circuits, September, 2023

A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
IEEE J. Solid State Circuits, 2023

A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022
A Tiled Ultrasound Matrix Transducer for Volumetric Imaging of the Carotid Artery.
Sensors, 2022

A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography.
IEEE J. Solid State Circuits, 2022

A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022

A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging.
Sensors, 2021

Combining Ultrafast Ultrasound and High-Density EMG to Assess Local Electromechanical Muscle Dynamics: A Feasibility Study.
IEEE Access, 2021

A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2018
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging.
IEEE J. Solid State Circuits, 2018

A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
IEEE J. Solid State Circuits, 2018

A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2017
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography.
IEEE J. Solid State Circuits, 2017

A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017

2009
The use of microbubbles in Doppler ultrasound studies.
Medical Biol. Eng. Comput., 2009


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