Hongjun Ji

According to our database, Hongjun Ji authored at least 1 paper in 2016.

Collaborative distances:

• no known Dijkstra number.
• no known Erdős number.

2016

Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging.

Hongjun Ji, Jiao Wang, Mingyu Li

Microelectron. Reliab., 2016