Ikuo Ohnuma

According to our database, Ikuo Ohnuma authored at least 2 papers between 2006 and 2007.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2007

Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device.

Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Ikuo Nakagawa, Takashi Atsumi, Mikio Shirai, Ikuo Ohnuma, Kiyohito Ishida

Microelectron. Reliab., 2007

2006

Pb-free high temperature solders for power device packaging.

Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Y. Nishibe, Ikuo Ohnuma, Yuji Sutou, R. Kainuma, Kiyohito Ishida

Microelectron. Reliab., 2006