Yasushi Yamada

According to our database¹, Yasushi Yamada authored at least 9 papers between 2006 and 2016.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

Timeline

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Book

In proceedings

Article

PhD thesis

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On csauthors.net:

Bibliography

2016

Novel heatsink for power semiconductor module using high thermal conductivity graphite.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2016

Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2016

2015

Thermal simulation of joints with high thermal conductivities for power electronic devices.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

2014

Reliability of Cu nanoparticle joint for high temperature power electronics.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2014

Research on the Form Recognition of Fabric Products: Acquiring the Shapes of Flat, Limp Materials.

[BibT_eX]

[DOI]

Fumiaki Osawa

Kazunori Kanou

Yasushi Yamada

Int. J. Autom. Technol., 2014

2013

Thermal characterizations of Cu nanoparticle joints for power semiconductor devices.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2013

2012

Power semiconductor module using a bonding film with anisotropic thermal conduction.

[BibT_eX]

[DOI]

Yasushi Yamada

Microelectron. Reliab., 2012

2007

Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2007

2006

Pb-free high temperature solders for power device packaging.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2006

Yasushi Yamada

Timeline

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Links

On csauthors.net:

Bibliography

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