J. Bielen

According to our database1, J. Bielen authored at least 1 paper in 2003.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

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Links

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Bibliography

2003
The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates.
Microelectron. Reliab., 2003


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