N. Duan

According to our database, N. Duan authored at least 1 paper in 2003.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2003

The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates.

N. Duan, J. Scheer, J. Bielen, M. van Kleef

Microelectron. Reliab., 2003