Jan Drewniok
Orcid: 0000-0002-7545-159X
According to our database1,
Jan Drewniok authored at least 8 papers
between 2023 and 2026.
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Bibliography
2026
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., April, 2026
Mastering the Exponential Complexity of Exact Physical Simulation of Silicon Dangling Bonds.
Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026
2025
Live Demonstration: An Application for Layout Resilience Analysis of Silicon Dangling Bond Logic.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2025
QuickTrace: An Efficient Contour Tracing Algorithm for Defect Robustness Simulation of Silicon Dangling Bond Logic.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2025
Proceedings of the Design, Automation & Test in Europe Conference, 2025
2024
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024
2023
Reducing the Complexity of Operational Domain Computation in Silicon Dangling Bond Logic.
Proceedings of the 18th ACM International Symposium on Nanoscale Architectures, 2023
Minimal Design of SiDB Gates: An Optimal Basis for Circuits Based on Silicon Dangling Bonds.
Proceedings of the 18th ACM International Symposium on Nanoscale Architectures, 2023