Jang-Kyo Kim

Orcid: 0000-0002-5390-8763

According to our database1, Jang-Kyo Kim authored at least 2 papers between 2006 and 2008.

Collaborative distances:
  • no known Dijkstra number2.
  • no known Erdős number3.

Timeline

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Links

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Bibliography

2008
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise.
Microelectron. Reliab., 2008

2006
Effects of bonding force on contact pressure and frictional energy in wire bonding.
Microelectron. Reliab., 2006


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