Jason D. Reed

Affiliations:

RTI International, Research Triangle Park, NC, USA

According to our database¹, Jason D. Reed authored at least 1 paper in 2010.

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Dijkstra number² of six.
Erdős number³ of six.

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2010

Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Jason D. Reed

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