Scott H. Goodwin

According to our database, Scott H. Goodwin authored at least 5 papers between 2010 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Innovative practices on design & test for flexible hybrid electronics.

Tsung-Ching Jim Huang, Jason Marsh, Scott H. Goodwin, Dorota S. Temple

Proceedings of the 36th IEEE VLSI Test Symposium, 2018

2014

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test.

Dorota S. Temple, Dean Malta, Erik P. Vick, Matthew R. Lueck, Scott H. Goodwin, Mark S. Muzilla, Christopher M. Masterjohn, Mark R. Skokan

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2011

Vias-last process technology for thick 2.5D Si interposers.

Erik Vick, Scott H. Goodwin, Garry Cunnigham, Dorota Temple

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration.

Jason D. Reed, Scott H. Goodwin, Christopher Gregory, Dorota Temple

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Fabrication of TSV-based silicon interposers.

Dean Malta, Erik Vick, Scott H. Goodwin, Christopher Gregory, Matthew Lueck, Alan Huffman, Dorota Temple

Proceedings of the IEEE International Conference on 3D System Integration, 2010