Jean-Pierre Landesman

According to our database, Jean-Pierre Landesman authored at least 5 papers between 2006 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Evidence of chlorine ion penetration in InP/InAsP quantum well structures during dry etching processes and effects of induced-defects on the electronic and structural behaviour.

Jean-Pierre Landesman, Christophe Levallois, Juan Jiménez, Frédéric Pommereau, Yoan Léger, Alexandre Beck, Thomas Delhaye, Alfredo Torres, Cesare Frigeri, Ahmed Rhallabi

Microelectron. Reliab., 2015

2010

Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications.

Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman, Manoubi Auguste Bahi

Microelectron. Reliab., 2010

2009

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages.

Manoubi Auguste Bahi, Hélène Frémont, Jean-Pierre Landesman, Annabelle Gentil, Pascal Lecuyer

Microelectron. Reliab., 2009

2007

Sequential environmental stresses tests qualification for automotive components.

Manoubi Auguste Bahi, Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman

Microelectron. Reliab., 2007

2006

Conception of optical integrated circuits on polymers.

Bruno Bêche, N. Pelletier, Etienne Gaviot, R. Hierle, Antoine Goullet, Jean-Pierre Landesman, J. Zyss

Microelectron. J., 2006