Jiatong Liu

According to our database1, Jiatong Liu authored at least 13 papers between 2015 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2023
Wind speed point prediction and interval prediction method based on linear prediction model, neural network, and deep learning.
J. Ambient Intell. Humaniz. Comput., July, 2023

2022
Multiple Granularities Generative Adversarial Network for Recognition of Wafer Map Defects.
IEEE Trans. Ind. Informatics, 2022

2021
Two-Dimensional Principal Component Analysis-Based Convolutional Autoencoder for Wafer Map Defect Detection.
IEEE Trans. Ind. Electron., 2021

Thermodynamic motif analysis for directed stock market networks.
Pattern Recognit., 2021

Action recognition for sports video analysis using part-attention spatio-temporal graph convolutional network.
J. Electronic Imaging, 2021

Cross-subject EEG emotion classification based on few-label adversarial domain adaption.
Expert Syst. Appl., 2021

Automatic Terrain Generation System Based on Path Search Optimization.
Proceedings of the CONF-CDS 2021: The 2nd International Conference on Computing and Data Science, 2021

FES-RF: A Feature Ensemble Selection Based Random Forest Method For Accurate Cancer Screening.
Proceedings of the IEEE International Conference on Bioinformatics and Biomedicine, 2021

2020
Application of data mining technology and wireless network sensing technology in sports training index analysis.
EURASIP J. Wirel. Commun. Netw., 2020

Spatiotemporal Changes in the Urban Heat Island Intensity of Distinct Local Climate Zones: Case Study of Zhongshan District, Dalian, China.
Complex., 2020

2019
Design and development of sports training system based on image processing technology.
Clust. Comput., 2019

Stacked convolutional sparse denoising auto-encoder for identification of defect patterns in semiconductor wafer map.
Comput. Ind., 2019

2015
Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015


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