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Johan Liu

According to our database¹, Johan Liu authored at least 6 papers between 2003 and 2017.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Awards

IEEE Fellow

IEEE Fellow 2006, "For contributions to environmentally compatible electronic materials and processes.".

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

Dataset

Other

Links

On csauthors.net:

Bibliography

2017

Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions.

[BibT_eX]

[DOI]

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Microelectron. Reliab., 2017

2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging.

[BibT_eX]

[DOI]

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Microelectron. Reliab., 2016

2007

Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints.

[BibT_eX]

[DOI]

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D. R. Andersson

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Per-Erik Tegehall

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Microelectron. Reliab., 2007

2004

Study on thermomechanical reliability of a tunable light modulator.

[BibT_eX]

[DOI]

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Helge Kristiansen

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Morten Eliassen

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Microelectron. Reliab., 2004

2003

System-on-package: a broad perspective from system design to technology development.

[BibT_eX]

[DOI]

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Microelectron. Reliab., 2003

Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2003

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