John Osenbach

According to our database, John Osenbach authored at least 8 papers between 2006 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

High-performance 100 Gbaud Coherent Photonic Modules.

Mehrdad Ziari, Vikrant Lal, Pavel Studenkov, Hossein Hodaei, Thomas Frost, Corey Tsai, Koichi Hoshino, Babak Behnia, Ryan Going, Stefan Wolf, Stefano Porto, Matthias Kuntz, Thomas Vallaitis, Ehsan Sooudi, Justin Lavrencik, Randal Salvatore, Nikhil Modi, Payam Abolghasem, Matt Fisher, Sanjeev Murthy, Sanketh Buggaveeti, Robert Brigham, Don Pavinski, Jiaming Zhang, Scott Corzine, Peter Evans, Vince Dominic, Robert Maher, Pierre Mertz, Steve Sanders, Han Sun, John Osenbach, Parthiban Kandappan

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

Reliability of optoelectronic module An Introduction.

John Osenbach

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

1.6Tbps Coherent 2-Channel Transceiver using a Monolithic Tx/Rx InP PIC and Single SiGe ASIC.

Vikrant Lal, Pavel Studenkov, Thomas Frost, Huan-Shang Tsai, B. Behnia, John Osenbach, Stefan Wolf, Ryan Going, Stefano Porto, Robert Maher, Hossein Hodaei, J. Zhang, C. Di Giovanni, K. Hoshino, Thomas Vallaitis, Bryan Ellis, J. Yan, K. Fong, Ehsan Sooudi, Matthias Kuntz, Sanketh Buggaveeti, Don Pavinski, Steve Sanders, Z. Wang, G. Hoefler, Peter Evans, Scott Corzine, Tim Butrie, Mehrdad Ziari, Fred Kish, David Welch

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020

800G over 1000 km enabled by real-time DSP ASIC employing Probabilistic Shaping and Digital Sub-Carrier Multiplexing.

Han Sun, Mehdi Torbatian, Mehdi Karimi, Robert Maher, Sandy Thomson, Mohsen Nader Tehrani, Yuliang Gao, Ales Kumpera, George Soliman, Aditya Kakkar, Mohammad Osman, Ziad A. El-Sahn, Clayton Doggart, Weikun Hou, Shailesh Sutarwala, Yuejian Wu, Mohammad Reza Chitgarha, Vikrant Lal, Huan-Shang Tsai, Scott Corzine, Jiaming Zhang, John Osenbach, Sanketh Buggaveeti, Zulfikar Morbi, Miguel Iglesias Olmedo, Irene Leung, Xian Xu, Parmijit Samra, Vince Dominic, Steve Sanders, Mehrdad Ziari, Antonio Napoli, Bernhard Spinnler, Kuang-Tsan Wu, Parthiban Kandappan

Proceedings of the 22nd International Conference on Transparent Optical Networks, 2020

2×800 Gbps/wave Coherent Optical Module Using a Monolithic InP Transceiver PIC.

Mohammad Reza Chitgarha, Pavel Studenkov, Jianping Zhang, Hossein Hodaei, Thomas Frost, Huan-Shang Tsai, Sanketh Buggaveeti, Amir Rashidinejad, Amin Yekani, Reza Mirzaei Nejad, Samantha Kerns, Júlio C. M. Diniz, Don Pavinski, Robert Brigham, Ben Foo, Mohammad Al-Khateeb, Swen Koenig, Stefan Wolf, Ryan Going, Stefano Porto, Irene Leung, Robert Maher, Vince Dominic, Han Sun, Steve Sanders, John Osenbach, Scott Corzine, Peter Evans, Vikrant Lal, Mehrdad Ziari

Proceedings of the European Conference on Optical Communications, 2020

2018

4×600 Gb/s Photonic IC Transmitter and Receiver Modules.

Ryan Going, Stefan Wolf, Robert Maher, Chris Berry, Pavel Studenkov, M. Lu, Vikrant Lal, Peter Evans, H. Tsai, Scott Corzine, Jianping Zhang, B. Behnia, J. Tang, Thomas Vallaitis, John Osenbach, Matthias Kuntz, A. Hosseini, Thomas Frost, Linus C. Chuang, M. Montazeri, H. Mousavi, Stefano Porto, Sanketh Buggaveeti, Xian Xu, Jeff Rahn, Tim Butrie, A. Karanicolas, Mehrdad Ziari, David Welch, Fred Kish

Proceedings of the European Conference on Optical Communication, 2018

2017

Multi-channel InP-based Coherent PICs with Hybrid Integrated SiGe Electronics Operating up to 100 GBd, 32QAM.

Ryan Going, Matthias Lauermann, Robert Maher, H. Tsai, M. Lu, N. Kim, Scott Corzine, Pavel Studenkov, Joseph Summers, A. Hosseini, Jianping Zhang, B. Behnia, J. Tang, S. Buggaveeti, Thomas Vallaitis, John Osenbach, Matthias Kuntz, X. Xu, Kevin Croussore, Vikrant Lal, Peter Evans, Jeff Rahn, Tim Butrie, A. Karanicolas, K.-T. Wu, Matthew Mitchell, Mehrdad Ziari, David Welch, Fred Kish

Proceedings of the European Conference on Optical Communication, 2017

2006

Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging.

Jongwoo Park, John Osenbach

Microelectron. Reliab., 2006