Jong Kyung Park

According to our database, Jong Kyung Park authored at least 2 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2024

First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer.

Sang Woo Park, Seul Ki Hong, Sarah Eunkyung Kim, Jong Kyung Park

IEEE Access, 2024

2023

Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding.

Jong Kyung Park, Sang-Woo Park, Min-Seong Jeong

Proceedings of the 20th International SoC Design Conference, 2023