Sarah Eunkyung Kim

According to our database, Sarah Eunkyung Kim authored at least 6 papers between 2010 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application.

Han Kyeol Seo, Hae-Sung Park, Sarah Eunkyung Kim

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding.

Hae-Sung Park, Han Kyeol Seo, Sarah Eunkyung Kim

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2014

Characterization of flip chip bonded structure with Cu ABL power bumps.

Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim

Microelectron. Reliab., 2014

2011

Evaluation of wafer level Cu bonding for 3D integration.

Sung-Geun Kang, Youngrae Kim, Eun-Sol Kim, Naeun Lim, Teakgyu Jeong, Jieun Lee, Sarah Eunkyung Kim, Sungdong Kim

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Dynamic flow measurements of capillary underfill through a bump array in flip chip package.

Seok Hwan Lee, Jaeyong Sung, Sarah Eunkyung Kim

Microelectron. Reliab., 2010

Study of thinned Si wafer warpage in 3D stacked wafers.

Youngrae Kim, Sung-Keun Kang, Sarah Eunkyung Kim

Microelectron. Reliab., 2010