K. Suganuma

According to our database, K. Suganuma authored at least 4 papers between 2003 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Low-temperature low-pressure die attach with hybrid silver particle paste.

K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K. S. Kim, M. Nogi

Microelectron. Reliab., 2012

2006

Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure.

M. Yamashita, K. Suganuma

Microelectron. Reliab., 2006

Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers.

M. Yamashita, K. Suganuma

Microelectron. Reliab., 2006

2003

Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu.

K. S. Kim, S. H. Huh, K. Suganuma

Microelectron. Reliab., 2003