Ke Li

Orcid: 0000-0003-3481-3272

Affiliations:
  • Jiangnan University, Wuxi, Jiangsu, China


According to our database1, Ke Li authored at least 11 papers between 2017 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2025
Semi-supervised dual-constraint centroid contrastive prototypical network for flip chip defect detection under limited labeled data.
Eng. Appl. Artif. Intell., 2025

2024
Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection.
IEEE Trans. Ind. Informatics, August, 2024

Category-level selective dual-adversarial network using significance-augmented unsupervised domain adaptation for surface defect detection.
Expert Syst. Appl., March, 2024

Flip-chip solder bumps defect detection using a self-search lightweight framework.
Adv. Eng. Informatics, 2024

2023
A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection.
IEEE Trans. Instrum. Meas., 2023

2021
Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation.
IEEE Trans. Ind. Electron., 2021

2019
A novel fault diagnosis algorithm for rotating machinery based on a sparsity and neighborhood preserving deep extreme learning machine.
Neurocomputing, 2019

Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound.
IEEE Access, 2019

A New Rotation Machinery Fault Diagnosis Method Based on Deep Structure and Sparse Least Squares Support Vector Machine.
IEEE Access, 2019

2018
Using GA-SVM for defect inspection of flip chips based on vibration signals.
Microelectron. Reliab., 2018

2017
New Particle Filter Based on GA for Equipment Remaining Useful Life Prediction.
Sensors, 2017


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