Keith Buchanan

According to our database, Keith Buchanan authored at least 2 papers between 2009 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

Plasma etch and dielectric deposition processes for TSV Reveal.

Keith Buchanan, Dave Thomas, Hefin Griffiths, Kathrine Crook, Daniel Archard, Mark Carruthers, Masahiko Tanaka

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

Etch, dielectrics and metal barrier-seed for low temperature through-silicon via processing.

Keith Buchanan, Stephen Burgess, Kathrine Giles, Matthew Muggeridge, Hao Zhao

Proceedings of the IEEE International Conference on 3D System Integration, 2009