Keith W. Sweatman

According to our database, Keith W. Sweatman authored at least 2 papers between 2011 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review.

Shi-Qian Liu, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita

Microelectron. Reliab., 2018

2011

The influence of solder composition on the impact strength of lead-free solder ball grid array joints.

H. Tsukamoto, T. Nishimura, S. Suenaga, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita

Microelectron. Reliab., 2011