Klaus-Jürgen Wolter

According to our database, Klaus-Jürgen Wolter authored at least 11 papers between 2001 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems.

Krzysztof Nieweglowski, Lukas Lorenz, Sebastian Lüngen, Tobias Tiedje, Klaus-Jürgen Wolter, Karlheinz Bock

Microelectron. Reliab., 2018

2015

pH measurements of FET-based (bio)chemical sensors using portable measurement system.

Tetiana Voitsekhivska, Felix Zorgiebel, Eike Suthau, Klaus-Jürgen Wolter, Karlheinz Bock, Gianaurelio Cuniberti

Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015

2014

Characterization of ionic permeability and water vapor transmission rate of polymers used for implantable electronics.

Sabine Kirsten, Martin Schubert, Jurgen Uhlemann, Klaus-Jürgen Wolter

Proceedings of the 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2014

2008

The effect of downscaling the dimensions of solder interconnects on their creep properties.

Steffen Wiese, Mike Roellig, Maik Mueller, Klaus-Jürgen Wolter

Microelectron. Reliab., 2008

Study of temperature dependent properties of organic substrate materials.

Bjoern Boehme, Klaus-Jürgen Wolter

Microelectron. Reliab., 2008

2007

Creep of thermally aged SnAgCu-solder joints.

Steffen Wiese, Klaus-Jürgen Wolter

Microelectron. Reliab., 2007

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.

Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel

Microelectron. Reliab., 2007

2006

Electronics Process Technology - Production Modelling, Simulation and Optimisation.

Wilfried Sauer, Martin Oppermann, Sebastian Werner, Heinz Wohlrabe, Thomas Zerna, Gerald Weigert, Klaus-Jürgen Wolter

Springer, ISBN: 978-1-84628-353-6, 2006

2004

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders.

Steffen Wiese, Klaus-Jürgen Wolter

Microelectron. Reliab., 2004

2003

Fodel microresistors-processing and basic electrical properties.

Andrzej Dziedzic, Lars Rebenklau, Leszek J. Golonka, Klaus-Jürgen Wolter

Microelectron. Reliab., 2003

2001

Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors.

Andrzej Dziedzic, Leszek J. Golonka, Jaroslaw Kita, Heiko Thust, Karl-Heinz Drue, Reinhard Bauer, Lars Rebenklau, Klaus-Jürgen Wolter

Microelectron. Reliab., 2001