Bernhard Wunderle
Orcid: 0000-0001-9675-4365
According to our database1,
Bernhard Wunderle
authored at least 19 papers
between 2004 and 2023.
Collaborative distances:
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Bibliography
2023
Accelerated Real-Life (ARL) Testing and Characterization of Automotive LiDAR Sensors to facilitate the Development and Validation of Enhanced Sensor Models.
CoRR, 2023
Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN).
Proceedings of the 29th International Conference on Mechatronics and Machine Vision in Practice, 2023
2022
Collaborative Filler Network for Enhancing the Performance of BaTiO3/PDMS Flexible Piezoelectric Polymer Composite Nanogenerators.
Sensors, 2022
2017
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy.
Microelectron. Reliab., 2017
Location resolved transient thermal analysis to investigate crack growth in solder joints.
Microelectron. Reliab., 2017
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests.
Microelectron. Reliab., 2017
2016
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
Microelectron. Reliab., 2016
Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
2014
Microelectron. Reliab., 2014
2013
Transport of moisture at epoxy-SiO<sub>2</sub> interfaces investigated by molecular modeling.
Microelectron. Reliab., 2013
2012
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.
Microelectron. Reliab., 2012
Proceedings of the International Multi-Conference on Systems, Signals & Devices, 2012
2011
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO<sub>2</sub> interface using molecular modelling.
Microelectron. Reliab., 2011
2010
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.
Microelectron. Reliab., 2010
2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2007
Microelectron. Reliab., 2007
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
Microelectron. Reliab., 2007
2006
Microelectron. Reliab., 2006
2004
Microelectron. Reliab., 2004