Konlin Shen

According to our database, Konlin Shen authored at least 8 papers between 2018 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Design of Ceramic Packages for Ultrasonically Coupled Implantable Medical Devices.

Konlin Shen, Michel M. Maharbiz

IEEE Trans. Biomed. Eng., 2020

Miniscope3D: optimized single-shot miniature 3D fluorescence microscopy.

Kyrollos Yanny, Nick Antipa, William Liberti, Sam Dehaeck, Kristina Monakhova, Fanglin Linda Liu, Konlin Shen, Ren Ng, Laura Waller

CoRR, 2020

An Automated System for Reactive Accelerated Aging of Implant Materials with In-Situ Testing.

Konlin Shen, Annabel Yau, Saarang Panchavati, Michel M. Maharbiz

Proceedings of the 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2020

2019

A Sub-mm³ Ultrasonic Free-Floating Implant for Multi-Mote Neural Recording.

Mohammad Meraj Ghanbari, David K. Piech, Konlin Shen, Sina Faraji Alamouti, Cem Yalcin, Benjamin C. Johnson, Jose M. Carmena, Michel M. Maharbiz, Rikky Muller

IEEE J. Solid State Circuits, 2019

A Sub-mm Ultrasonic Free-floating Implant for Multi-mote Neural Recording.

Mohammad Meraj Ghanbari, David K. Piech, Konlin Shen, Sina Faraji Alamouti, Cem Yalcin, Benjamin C. Johnson, Jose M. Carmena, Michel M. Maharbiz, Rikky Muller

CoRR, 2019

Ceramic Packages for Acoustically Coupled Neural Implants.

Konlin Shen, Michel M. Maharbiz

Proceedings of the 2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), 2019

A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System With Linear AM Backscattering.

Mohammad Meraj Ghanbari, David K. Piech, Konlin Shen, Sina Faraji Alamouti, Cem Yalcin, Benjamin C. Johnson, Jose M. Carmena, Michel M. Maharbiz, Rikky Muller

Proceedings of the IEEE International Solid- State Circuits Conference, 2019

2018

StimDust: A 6.5mm³, wireless ultrasonic peripheral nerve stimulator with 82% peak chip efficiency.

Benjamin C. Johnson, Konlin Shen, David K. Piech, Mohammad Meraj Ghanbari, Ka Yiu Li, Ryan Neely, Jose M. Carmena, Michel M. Maharbiz, Rikky Muller

Proceedings of the 2018 IEEE Custom Integrated Circuits Conference, 2018