L. Hua

According to our database¹, L. Hua authored at least 2 papers between 2011 and 2017.

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2017

Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2017

2011

Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2011