Lingyu Bi

According to our database, Lingyu Bi authored at least 2 papers between 2019 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Impact of ground solder ball failure in BGA package on near electric field radiation.

Yidong Yuan, Tianmeng Zhang, Ziren Wang, Kaixuan Song, Lingyu Bi, Lu Tian, Jinchun Gao

IEICE Electron. Express, 2022

2019

Investigation of the improvement of signal integrity in electrical circuits with degraded contacts using differential transmission.

Ziren Wang, Jinchun Gao, George T. Flowers, Lingyu Bi, Gang Xie, Yilin Zhou

IET Circuits Devices Syst., 2019