Lok-kun Tsui
Orcid: 0000-0001-7381-0686
According to our database1,
Lok-kun Tsui authored at least 3 papers
between 2020 and 2025.
Collaborative distances:
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Bibliography
2025
Flexible Superconducting Interconnects Realized by Electrodeposition of Rhenium on an Aerosol Jet Printed Seed Layer.
Proceedings of the IEEE International Conference on Quantum Computing and Engineering, 2025
2024
Early-warning systems built on an AI-powered, IoT-driven multi-gas emission sensor platform.
Proceedings of the 67th IEEE International Midwest Symposium on Circuits and Systems, 2024
2020
J. Open Source Softw., 2020