Mario Bendra

According to our database, Mario Bendra authored at least 7 papers between 2021 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Influence of Interface Exchange Coupling in Multilayered Spintronic Structures.

Mario Bendra, R. L. de Orio, Siegfried Selberherr, Wolfgang Goes, Viktor Sverdlov

Proceedings of the 47th MIPRO ICT and Electronics Convention, 2024

Advancing Nonvolatile Memory Technologies: Enhancing Reliability and Performance through Double Spin Torque Magnetic Tunnel Junctions and Interlayer Exchange Coupling.

Mario Bendra, Bernhard Pruckner, R. L. de Orio, Siegfried Selberherr, Wolfgang Goes, Viktor Sverdlov

Proceedings of the Device Research Conference, 2024

2023

Back-Hopping in Ultra-Scaled MRAM Cells.

Mario Bendra, Simone Fiorentini, Johannes Ender, R. L. de Orio, T. Hadámek, Nils Petter Jørstad, Bernhard Pruckner, Siegfried Selberherr, Wolfgang Goes, Viktor Sverdlov

Proceedings of the 46th MIPRO ICT and Electronics Convention, 2023

Comprehensive Modeling of Advanced Composite Magnetoresistive Devices.

Viktor Sverdlov, Mario Bendra, Bernhard Pruckner, Simone Fiorentini, Wolfgang Goes, Siegfried Selberherr

Proceedings of the 53rd IEEE European Solid-State Device Research Conference, 2023

2022

Spin Transfer Torques in Ultra-Scaled MRAM Cells.

Mario Bendra, Simone Fiorentini, Johannes Ender, R. L. de Orio, T. Hadámek, W. J. Loch, Nils Petter Jørstad, Siegfried Selberherr, Wolfgang Goes, Viktor Sverdlov

Proceedings of the 45th Jubilee International Convention on Information, 2022

Spin Torques in ULTRA-Scaled MRAM Devices.

Simone Fiorentini, Mario Bendra, Johannes Ender, Roberto Lacerda de Orio, Wolfgang Goes, Siegfried Selberherr, Viktor Sverdlov

Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

2021

Finite Element Method Approach to MRAM Modeling.

Mario Bendra, Johannes Ender, Simone Fiorentini, T. Hadámek, Roberto Lacerda de Orio, Wolfgang Goes, Viktor Sverdlov, Siegfried Selberherr

Proceedings of the 44th International Convention on Information, 2021