Maximilian Schmid

According to our database, Maximilian Schmid authored at least 5 papers between 2015 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

A New Noise-Suppression Algorithm for Transient Thermal Analysis in Semiconductors Over Pulse Superposition.

Maximilian Schmid, Sri Krishna Bhogaraju, Alexander Hanss, Gordon Elger

IEEE Trans. Instrum. Meas., 2021

2019

Improving the Blockchain User Experience - An Approach to Address Blockchain Mass Adoption Issues from a Human-Centred Perspective.

Leonhard Glomann, Maximilian Schmid, Nika Kitajewa

Proceedings of the Advances in Artificial Intelligence, Software and Systems Engineering, 2019

2016

The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs.

E. Liu, Alexander Hanss, Maximilian Schmid, Gordon Elger

Microelectron. Reliab., 2016

Transient thermal analysis for accelerated reliability testing of LEDs.

Gordon Elger, Dominik Müller, Alexander Hanß, Maximilian Schmid, E. Liu, Udo Karbowski, Robert Derix

Microelectron. Reliab., 2016

2015

Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations.

Gordon Elger, Shri Vishnu Kandaswamy, E. Liu, Alexander Hanss, Maximilian Schmid, Robert Derix, Fosca Conti

Microelectron. J., 2015