E. Liu
This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.
Bibliography
2017
Location resolved transient thermal analysis to investigate crack growth in solder joints.
Microelectron. Reliab., 2017
2016
The influence of the phosphor layer as heat source and up-stream thermal masses on the thermal characterization by transient thermal analysis of modern wafer level high power LEDs.
Microelectron. Reliab., 2016
Microelectron. Reliab., 2016
2015
Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations.
Microelectron. J., 2015
2011
Mechanization of deep tillage and mulching to improve soil water content and spring maize yield.
Proceedings of the International Conference on Electronic and Mechanical Engineering and Information Technology, 2011
Effect of burying the straw deeply and plastic mulching on soil water and yield of spring-sown maize.
Proceedings of the International Conference on Electronic and Mechanical Engineering and Information Technology, 2011
1998
Proceedings of the IEEE 1998 Custom Integrated Circuits Conference, 1998