Meixian Jiang
Orcid: 0000-0001-7639-5385
According to our database1,
Meixian Jiang
authored at least 3 papers
between 2014 and 2019.
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Bibliography
2019
ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints.
IEEE Access, 2019
Study on the Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive.
IEEE Access, 2019
2014