Mohammad Hossein Mahdavifard

According to our database, Mohammad Hossein Mahdavifard authored at least 2 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment.

Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard

Microelectron. Reliab., 2018

2015

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy.

Mohammad Hossein Mahdavifard, Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Suhana Mohd Said, Irfan Anjum Badruddin, S. Rozali

Microelectron. Reliab., 2015