Dhafer Abdulameer Shnawah

According to our database, Dhafer Abdulameer Shnawah authored at least 3 papers between 2012 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2015

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy.

Mohammad Hossein Mahdavifard, Mohd Faizul Mohd Sabri, Dhafer Abdulameer Shnawah, Suhana Mohd Said, Irfan Anjum Badruddin, S. Rozali

Microelectron. Reliab., 2015

2012

Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products.

Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che

Microelectron. Reliab., 2012

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products.

Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin

Microelectron. Reliab., 2012