Morihiro Kada
According to our database1,
Morihiro Kada
authored at least 2 papers
between 2009 and 2011.
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Bibliography
2011
Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2009
Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices.
Proceedings of the IEEE International Conference on 3D System Integration, 2009