Myong-Suk Kang

According to our database, Myong-Suk Kang authored at least 2 papers in 2011.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2011

Advanced TSV filling method with Sn alloy and its reliability.

Young-Ki Ko, Myong-Suk Kang, Hiroyuki Kokawa, Yutaka S. Sato, Sehoon Yoo, Chang-Woo Lee

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC.

Won-Myoung Ki, Myong-Suk Kang, Sehoon Yoo, Chang-Woo Lee

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011