Nauman H. Khan

According to our database, Nauman H. Khan authored at least 8 papers between 2009 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

A Low-Cost IoT Based System for Environmental Monitoring.

Nauman H. Khan, Khurram S. Khattak, Shaukat Ullah, Zawar H. Khan

Proceedings of the International Conference on Frontiers of Information Technology, 2019

2013

Designing TSVs for 3D Integrated Circuits

Nauman H. Khan, Soha Hassoun

Springer Briefs in Electrical and Computer Engineering, Springer, ISBN: 978-1-4614-5508-0, 2013

2012

The feasibility of Carbon Nanotubes for power delivery in 3-D Integrated Circuits.

Nauman H. Khan, Soha Hassoun

Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2011

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.

Nauman H. Khan, Syed M. Alam, Soha Hassoun

IEEE Trans. Very Large Scale Integr. Syst., 2011

Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs.

Nauman H. Khan, Syed M. Alam, Soha Hassoun

Proceedings of the 12th International Symposium on Quality Electronic Design, 2011

2010

Early estimation of TSV area for power delivery in 3-D integrated circuits.

Nauman H. Khan, Sherief Reda, Soha Hassoun

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

System-level comparison of power delivery design for 2D and 3D ICs.

Nauman H. Khan, Syed M. Alam, Soha Hassoun

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs.

Nauman H. Khan, Syed M. Alam, Soha Hassoun

Proceedings of the IEEE International Conference on 3D System Integration, 2009