Ndy N. Ekere

According to our database, Ndy N. Ekere authored at least 5 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly.

M. T. Zarmai, Ndy N. Ekere, C. F. Oduoza, Emeka H. Amalu

Microelectron. Reliab., 2016

2012

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device.

Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu

Microelectron. Reliab., 2012

High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height.

Emeka H. Amalu, Ndy N. Ekere

Microelectron. Reliab., 2012

Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations.

Emeka H. Amalu, Ndy N. Ekere

Microelectron. Reliab., 2012

2011

Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges.

Kenny C. Otiaba, Ndy N. Ekere, R. S. Bhatti, Sabuj Mallik, M. O. Alam, Emeka H. Amalu

Microelectron. Reliab., 2011