Mathias Ekpu

According to our database, Mathias Ekpu authored at least 3 papers between 2012 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2014

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.

Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba

Microelectron. Reliab., 2014

The effect of thermal constriction on heat management in a microelectronic application.

Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba

Microelectron. J., 2014

2012

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device.

Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu

Microelectron. Reliab., 2012