Nowshad Amin

Orcid: 0000-0002-3250-1307

According to our database1, Nowshad Amin authored at least 15 papers between 2007 and 2023.

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Bibliography

2023
A comprehensive study and performance analysis of deep neural network-based approaches in wind time-series forecasting.
J. Reliab. Intell. Environ., June, 2023

2022
Transparent Antenna for Green Communication Feature: A Systematic Review on Taxonomy Analysis, Open Challenges, Motivations, Future Directions and Recommendations.
IEEE Access, 2022

2021
An Adaptive TE-PV Hybrid Energy Harvesting System for Self-Powered IoT Sensor Applications.
Sensors, 2021

An Improved Vulnerability Exploitation Prediction Model with Novel Cost Function and Custom Trained Word Vector Embedding.
Sensors, 2021

A Comparative Performance Analysis of ANN Algorithms for MPPT Energy Harvesting in Solar PV System.
IEEE Access, 2021

A Portable Electromagnetic Head Imaging System Using Metamaterial Loaded Compact Directional 3D Antenna.
IEEE Access, 2021

2020
Perceiving of Defect Tolerance in Perovskite Absorber Layer for Efficient Perovskite Solar Cell.
IEEE Access, 2020

A Gap Coupled Hexagonal Split Ring Resonator Based Metamaterial for S-Band and X-Band Microwave Applications.
IEEE Access, 2020

Tailoring of the Structural and Optoelectronic Properties of Zinc-Tin-Oxide Thin Films via Oxygenation Process for Solar Cell Application.
IEEE Access, 2020

2019
Left-Handed Metamaterial-Inspired Unit Cell for S-Band Glucose Sensing Application.
Sensors, 2019

A Modified Meander Line Microstrip Patch Antenna With Enhanced Bandwidth for 2.4 GHz ISM-Band Internet of Things (IoT) Applications.
IEEE Access, 2019

2018
A Polarization Independent Quasi-TEM Metamaterial Absorber for X and Ku Band Sensing Applications.
Sensors, 2018

2015
Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays.
J. Electronic Imaging, 2015

2009
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages.
Microelectron. Reliab., 2009

2007
Prospective development in diffusion barrier layers for copper metallization in LSI.
Microelectron. J., 2007


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