Ibrahim Ahmad

Orcid: 0000-0002-1649-2658

According to our database1, Ibrahim Ahmad authored at least 13 papers between 2006 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

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Bibliography

2024
Continuous-time quantum walks for MAX-CUT are hot.
Quantum, February, 2024

2021
Underwater Animal Detection Using YOLOV4.
Proceedings of the 11th IEEE International Conference on Control System, 2021

2019
The Evaluation of Mobile Educational Game Design Using 3i Factors.
Proceedings of the 9th IEEE International Conference on System Engineering and Technology, 2019

SCAN-ME: The Development of Augmented Reality Application Prototype using Information, Interface and Interaction Aspect.
Proceedings of the 9th IEEE International Conference on System Engineering and Technology, 2019

2017
Game Interface Design: Measuring the Player's Gameplay Experience.
Proceedings of the Advances in Visual Informatics, 2017

2012
Modelling of Process Parameters for 32nm PMOS Transistor Using Taguchi Method.
Proceedings of the Sixth Asia Modelling Symposium, 2012

2011
Game Design Framework: A Pilot Study on Users' Perceptions.
Proceedings of the Visual Informatics: Sustaining Research and Innovations, 2011

2010
Impact of HALO structure on threshold voltage and leakage current in 45nm NMOS device.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2010

2009
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages.
Microelectron. Reliab., 2009

2008
Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging
CoRR, 2008

2007
Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process.
Microelectron. Reliab., 2007

2006
Effect of wafer thinning methods towards fracture strength and topography of silicon die.
Microelectron. Reliab., 2006

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition.
Microelectron. Reliab., 2006


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