Paragkumar Thadesar

According to our database, Paragkumar Thadesar authored at least 3 papers between 2014 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Embedded cooling technologies for densely integrated electronic systems.

Thomas E. Sarvey, Yang Zhang, Li Zheng, Paragkumar Thadesar, Ravi Gutala, Colman Cheung, Arifur Rahman, Muhannad S. Bakir

Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications.

Muneeb Zia, Chaoqi Zhang, Paragkumar Thadesar, Tracy Hookway, Taiyun Chi, Joe L. Gonzalez, Todd C. McDevitt, Hua Wang, Muhannad S. Bakir

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2015

2014

Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects.

Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir

Proceedings of the 2014 International 3D Systems Integration Conference, 2014