Patrick Preuss

According to our database, Patrick Preuss authored at least 12 papers between 2010 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Backward Simulation: A Customer-Focused Diversification of Fab Simulation Applications in a Highly Automated Semiconductor Production Line.

Wolfgang Scholl, Patrick Preuss, Christoph Laroque, Madlene Leißau

Proceedings of the Winter Simulation Conference, 2023

2019

An Integration of Static and Dynamic Capacity Planning for a Ramping Fab.

Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang

Proceedings of the 2019 Winter Simulation Conference, 2019

2018

Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation.

Georg Seidel, Patrick Preuss, André Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan

Proceedings of the 2018 Winter Simulation Conference, 2018

Bridging the Gap between fab simulation and supply Chain Forecast.

Wolfgang Scholl, Matthias Forster, Patrick Preuss, André Naumann, Hui Ping Ooi, Boon-Ping Gan

Proceedings of the 2018 Winter Simulation Conference, 2018

2017

Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation.

Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, André Naumann, Patrick Preuss

Proceedings of the 2017 Winter Simulation Conference, 2017

An easy approach to extending a short term simulation model for long term forecast in semiconductor industry.

Marcin Mosinski, Tobias Weissgaerber, Soo Leen Low, Boon-Ping Gan, Patrick Preuss

Proceedings of the 2017 Winter Simulation Conference, 2017

2016

Simulation-enabled development lot journey smoothening in a fully-utilised semiconductor manufacturing line.

Wolfgang Scholl, Matthias Forster, Patrick Preuss, André Naumann, Boon-Ping Gan, Peter Lendermann

Proceedings of the Winter Simulation Conference, 2016

2014

Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling.

Patrick Preuss, André Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann

Proceedings of the 2014 Winter Simulation Conference, 2014

2013

Automatic model verification for semiconductor manufacturing simulation.

Boon-Ping Gan, Peter Lendermann, Wolfgang Scholl, Marcin Mosinski, Patrick Preuss

Proceedings of the Winter Simulations Conference: Simulation Making Decisions in a Complex World, 2013

2012

A multi-stage discrete event simulation approach for scheduling of maintenance activities in a semiconductor manufacturing line.

Wolfgang Scholl, Marcin Mosinski, Boon-Ping Gan, Peter Lendermann, Patrick Preuss, Daniel Noack

Proceedings of the Winter Simulation Conference, 2012

2011

Implementation of a simulation-based short-term lot arrival forecast in a mature 200mm semiconductor fab.

Wolfgang Scholl, Daniel Noack, Oliver Rose, Boon-Ping Gan, Peter Lendermann, Patrick Preuss, Falk Stefan Pappert

Proceedings of the Winter Simulation Conference 2011, 2011

2010

Towards realization of a high-fidelity simulation model for short-term horizon forecasting in wafer fabrication facilities.

Wolfgang Scholl, Boon-Ping Gan, Ming Li Peh, Peter Lendermann, Daniel Noack, Oliver Rose, Patrick Preuss

Proceedings of the 2010 Winter Simulation Conference, 2010