Chew Wye Chan

According to our database, Chew Wye Chan authored at least 8 papers between 2017 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Dispatching in Real Frontend Fabs With Industrial Grade Discrete-Event Simulations by Deep Reinforcement Learning with Evolution Strategies.

Patrick Stöckermann, Alessandro Immordino, Thomas Altenmüller, Georg Seidel, Martin Gebser, Pierre Tassel, Chew Wye Chan, Feifei Zhang

Proceedings of the Winter Simulation Conference, 2023

Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing.

Chew Wye Chan, Boon Ping Gan, Wentong Cai

Proceedings of the Winter Simulation Conference, 2023

2022

Graph Representation and Embedding for Semiconductor Manufacturing Fab States.

Benedikt Schulz, Christoph Jacobi, Andrej Gisbrecht, Angelidis Evangelos, Chew Wye Chan, Boon Ping Gan

Proceedings of the Winter Simulation Conference, 2022

2020

Towards Situation Aware Dispatching in a Dynamic and Complex Manufacturing Environment.

Chew Wye Chan, Boon Ping Gan, Wentong Cai

Proceedings of the Winter Simulation Conference, 2020

Runtime Abstraction-Level Conversion of Discrete-Event Wafer-fabrication Models for Simulation Acceleration.

Moon Gi Seok, Chew Wye Chan, Wentong Cai, Hessam S. Sarjoughian, Daejin Park

Proceedings of the 2019 ACM SIGSIM Conference on Principles of Advanced Discrete Simulation, 2020

2019

An Integration of Static and Dynamic Capacity Planning for a Ramping Fab.

Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang

Proceedings of the 2019 Winter Simulation Conference, 2019

2018

Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation.

Georg Seidel, Patrick Preuss, André Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan

Proceedings of the 2018 Winter Simulation Conference, 2018

2017

Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation.

Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, André Naumann, Patrick Preuss

Proceedings of the 2017 Winter Simulation Conference, 2017