Peng Guo

According to our database, Peng Guo authored at least 9 papers between 2021 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Correction to "A 2000-Volumes/s 3-D Ultrasound Probe With Monolithically-Integrated 23 × 23-mm² 4096-Element CMUT Array".

Nuriel N. M. Rozsa, Zhao Chen, Taehoon Kim, Peng Guo, Yannick M. Hopf, Jason D. Voorneveld, Djalma Simões dos Santos, Emile Noothout, Zu-Yao Chang, Chao Chen, Vincent A. Henneken, Nico de Jong, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Michiel A. P. Pertijs

IEEE J. Solid State Circuits, August, 2025

A 2000-volumes/s 3-D Ultrasound Probe With Monolithically-Integrated 23 × 23-mm² 4096 -Element CMUT Array.

Nuriel N. M. Rozsa, Zhao Chen, Taehoon Kim, Peng Guo, Yannick M. Hopf, Jason D. Voorneveld, Djalma Simões dos Santos, Emile Noothout, Zu-Yao Chang, Chao Chen, Vincent A. Henneken, Nico de Jong, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Michiel A. P. Pertijs

IEEE J. Solid State Circuits, April, 2025

A Single-Inductor-Based High-Voltage Transmit Beamformer for Wearable Ultrasound Devices Achieving 88% fCV² Power Reduction.

Peng Guo, Zu-Yao Chang, Michiel A. P. Pertijs, Tiago L. Costa

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2024

A 125 μ m-Pitch-Matched Transceiver ASIC With Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography.

Peng Guo, Fabian Fool, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs

IEEE J. Solid State Circuits, August, 2024

A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm² 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer.

Nuriel N. M. Rozsa, Zhao Chen, Taehoon Kim, Peng Guo, Yannick Hopf, Jason D. Voorneveld, Djalma Simões dos Santos, Emile Noothout, Zu-Yao Chang, Chao Chen, Vincent A. Henneken, Nico de Jong, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Michiel A. P. Pertijs

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023

A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging.

Peng Guo, Fabian Fool, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs

IEEE J. Solid State Circuits, September, 2023

A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.

Peng Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs

IEEE J. Solid State Circuits, 2023

2022

A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging.

Peng Guo, Fabian Fool, Emile Noothout, Zu-Yao Chang, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jonq, Michiel A. P. Pertijs

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021

A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.

Peng Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs

Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021