Peng Shi

Affiliations:

Xi'an Jiaotong University, School of Electronic and Information Engineering, Electronic Materials Research Laboratory, Xi'an, China

According to our database¹, Peng Shi authored at least 8 papers between 2016 and 2021.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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Bibliography

2021

A Tungsten-Rhenium Thin Film Thermocouples Sensor Based on AlN Transition Layer.

[BibT_eX]

[DOI]

Proceedings of the 16th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2021

2018

High Temperature High Sensitivity Multipoint Sensing System Based on Three Cascade Mach-Zehnder Interferometers.

[BibT_eX]

[DOI]

Sensors, 2018

Modeling and Analysis of a Combined Stress-Vibration Fiber Bragg Grating Sensor.

[BibT_eX]

[DOI]

Sensors, 2018

A Highly Thermostable In<sub>2</sub>O<sub>3</sub>/ITO Thin Film Thermocouple Prepared via Screen Printing for High Temperature Measurements.

[BibT_eX]

[DOI]

Sensors, 2018

Ordinary Optical Fiber Sensor for Ultra-High Temperature Measurement Based on Infrared Radiation.

[BibT_eX]

[DOI]

Sensors, 2018

2017

Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates.

[BibT_eX]

[DOI]

Sensors, 2017

Enhanced stability of ITO/In2O3 thin film thermocouples by coating Al2O3 layer.

[BibT_eX]

[DOI]

Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

2016

Lead-Free Piezoelectric Diaphragm Biosensors Based on Micro-Machining Technology and Chemical Solution Deposition.

[BibT_eX]

[DOI]

Sensors, 2016

Peng Shi

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