Pengpeng Yu
Orcid: 0000-0002-2947-1418
According to our database1,
Pengpeng Yu
authored at least 19 papers
between 2019 and 2025.
Collaborative distances:
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Bibliography
2025
CoRR, October, 2025
Re-Densification Meets Cross-Scale Propagation: Real-Time Compression of LiDAR Point Clouds.
CoRR, August, 2025
Vis. Comput., July, 2025
CoRR, July, 2025
Pack-PTQ: Advancing Post-training Quantization of Neural Networks by Pack-wise Reconstruction.
CoRR, May, 2025
IEEE Trans. Multim., 2025
IEEE Signal Process. Lett., 2025
Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops, 2025
Proceedings of the AAAI-25, Sponsored by the Association for the Advancement of Artificial Intelligence, February 25, 2025
2024
Lightweight Bit-Depth Recovery Network for Gaofen Satellite Multispectral Image Compression.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2024
Proceedings of the IEEE International Conference on Acoustics, 2024
2023
A Biomimetic Piezoelectric Composite-Driven Undulation Underwater Robotic Structure: Characteristic Analysis and Experimental Investigation.
Adv. Intell. Syst., December, 2023
Proceedings of the IEEE International Conference on Visual Communications and Image Processing, 2023
Sparse Representation based Deep Residual Geometry Compression Network for Large-scale Point Clouds.
Proceedings of the IEEE International Conference on Multimedia and Expo, 2023
Proceedings of the 6th International Conference on Information Technologies and Electrical Engineering, 2023
2022
Simulation Analysis of Wind-Light-Diesel-Storage Complementary Mobile Power Vehicles Based on MATLAB.
Proceedings of the 5th International Conference on Information Technologies and Electrical Engineering, 2022
2021
Proceedings of the ICITEE 2021: The 4th International Conference on Information Technologies and Electrical Engineering, Changde, Hunan, China, October 29, 2021
Proceedings of the ICITEE 2021: The 4th International Conference on Information Technologies and Electrical Engineering, Changde, Hunan, China, October 29, 2021
2019
Proceedings of the 28th IEEE International Symposium on Industrial Electronics, 2019