Peter Borgesen

According to our database, Peter Borgesen authored at least 5 papers between 2011 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Effects of latent damage of recrystallization on lead free solder joints.

Ahmad Mayyas, Awni Qasaimeh, Peter Borgesen, Michael Meilunas

Microelectron. Reliab., 2014

2013

Effects of 'Latent Damage' on pad cratering: Reduction in life and a potential change in failure mode.

Venkatesh Arasanipalai Raghavan, Brian Roggeman, Michael Meilunas, Peter Borgesen

Microelectron. Reliab., 2013

Solder joint reliability under realistic service conditions.

Peter Borgesen, S. Hamasha, Mazin Obaidat, V. Raghavan, X. Dai, Michael Meilunas, M. Anselm

Microelectron. Reliab., 2013

2012

Acceleration of the growth of Cu₃Sn voids in solder joints.

Peter Borgesen, Liang Yin, Pericles Kondos

Microelectron. Reliab., 2012

2011

Assessing the risk of "Kirkendall voiding" in Cu₃Sn.

Peter Borgesen, Liang Yin, Pericles Kondos

Microelectron. Reliab., 2011